A method for manufacturing a carrier tape housing a plurality of electronic components with seal materials includes forming housing holes in tape-shaped main body with first and second principal surfaces along a longitudinal direction of the tape-shaped main body, the housing holes penetrating from the first principal surface to the second principal surface, affixing an adhesive layer of a tape-shaped seal material to the second principal surface of the tape-shaped main body to cover the housing holes, forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions at least partially overlapping with the respective housing holes in a planar view from the other portions, and providing chip-shaped electronic component into each of the housing holes of the tape-shaped main body and fixing the electronic component to the adhesive layer of the seal material exposed in each of the housing holes.