Invention Grant
- Patent Title: Methods and devices for subcutaneous lead implantation
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Application No.: US14177424Application Date: 2014-02-11
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Publication No.: US10434307B2Publication Date: 2019-10-08
- Inventor: Mary L. Cole
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: A61B17/34
- IPC: A61B17/34 ; A61N1/05 ; A61N1/39 ; A61B17/32 ; A61B5/046 ; A61M25/01 ; A61N1/362

Abstract:
Devices and implantation methods utilizing subcutaneous placement into a patient are disclosed for the insertion, advancement and positioning of a subcutaneous implantable medical device (SIMD) such as a medical electrical lead. The SIMD is releasably-engaged with a device in accordance with embodiments of this disclosure, and advanced from an incision of the patient to an implant location. The implantation device may be disengaged from the SIMD without moving the SIMD from the implant location.
Public/Granted literature
- US20150105793A1 METHODS AND DEVICES FOR SUBCUTANEOUS LEAD IMPLANTATION Public/Granted day:2015-04-16
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