Invention Grant
- Patent Title: Roughened substrate support
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Application No.: US14675379Application Date: 2015-03-31
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Publication No.: US10434629B2Publication Date: 2019-10-08
- Inventor: Dongsuh Lee , William N. Sterling , Beom Soo Park , Soo Young Choi
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: B24C1/06
- IPC: B24C1/06 ; B24C1/00 ; H01L21/687 ; C23C16/458

Abstract:
The present disclosure generally relates to a substrate support for use in a substrate processing chamber. A roughened substrate support reduces arcing within the chamber and also contributes to uniform deposition on the substrate. A substrate support may have a substrate support body having a surface roughness of between about 707 micro-inches and about 834 micro-inches. The substrate support may have an anodized coating on the substrate support.
Public/Granted literature
- US20150202739A1 ROUGHENED SUBSTRATE SUPPORT Public/Granted day:2015-07-23
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