Invention Grant
- Patent Title: Thermoforming method and thermoforming apparatus
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Application No.: US15221546Application Date: 2016-07-27
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Publication No.: US10434700B2Publication Date: 2019-10-08
- Inventor: Sungwoo Eo , Hunkyo Kim , Byoungyul Shim , Jusuk Oh
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-si
- Agency: Lewis Roca Rothgerber Christie LLP
- Priority: KR10-2015-0141691 20151008
- Main IPC: B29C51/08
- IPC: B29C51/08 ; B29C51/42 ; B29C51/44 ; B29C51/20 ; B29C51/46 ; B29C53/04 ; B29K69/00 ; C03B23/025 ; B29C33/16 ; B29C33/32

Abstract:
Provided is a method of thermoforming a molding material to have a bent portion and a flat portion extending from the bent portion. The method includes: placing the molding material on a bending mold, the bending mold having a curved surface; and forming the bent portion of the molding material by heating a portion of the molding material at least to a fluidization temperature such that the portion of the molding material bends due to the weight of the flat portion of the molding material to form the bent portion according to a shape of the bending mold.
Public/Granted literature
- US20170100875A1 THERMOFORMING METHOD AND THERMOFORMING APPARATUS Public/Granted day:2017-04-13
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