Invention Grant
- Patent Title: Printing system comprising a microelectromechanical die and an application specific integrated circuit
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Application No.: US16240562Application Date: 2019-01-04
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Publication No.: US10434768B2Publication Date: 2019-10-08
- Inventor: Peter James Fricke , Andrew L. Van Brocklin
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/175 ; B41J2/14

Abstract:
In some examples, a printing system comprises a plurality of microelectromechanical systems (MEMS) dies comprising printing fluid jets, a printhead assembly (PHA) application specific integrated circuit (ASIC), and a substrate comprising the plurality of MEMS dies and the PHA ASIC. The PHA ASIC is to process image data into a plurality of data signals that define a firing pattern, and transmit the data signals through transmission lines on the substrate to the plurality of MEMS dies. The printing fluid jets of the plurality of MEMS dies are to fire in response to the data signals.
Public/Granted literature
- US20190152221A1 PRINTING SYSTEM COMPRISING A MICROELECTROMECHANICAL DIE AND AN APPLICATION SPECIFIC INTEGRATED CIRCUIT Public/Granted day:2019-05-23
Information query
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