Invention Grant
- Patent Title: Fluid supply assembly
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Application No.: US15763553Application Date: 2016-01-27
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Publication No.: US10434785B2Publication Date: 2019-10-08
- Inventor: Jeffrey G Bingham , Sam Sing , Justin M Roman
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Dierker & Kavanaugh PC
- International Application: PCT/US2016/015217 WO 20160127
- International Announcement: WO2017/131678 WO 20170803
- Main IPC: B41J2/175
- IPC: B41J2/175

Abstract:
In an example implementation, a fluid supply assembly includes a printhead assembly and a carriage comprising a quick-release, hand-operable attachment mechanism to removably attach the printhead assembly to the carriage. A fluid conduit interconnect is rigidly attached to the printhead assembly by a tool-operable fastener. The fluid conduit interconnect is to connect to a fluid conduit to communicate printing fluid from an off-axis printing fluid supply to the printhead assembly.
Public/Granted literature
- US20180264831A1 FLUID SUPPLY ASSEMBLY Public/Granted day:2018-09-20
Information query
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