Invention Grant
- Patent Title: Low stress stiffener runout in Pi bonded structure
-
Application No.: US16044118Application Date: 2018-07-24
-
Publication No.: US10435133B2Publication Date: 2019-10-08
- Inventor: Jan T. Jansen , Ryan Stott , William Vallellanes , Jack Van Es
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Miller, Matthias & Hull LLP
- Main IPC: B64C1/06
- IPC: B64C1/06 ; B64C3/18 ; B64G1/22 ; B63B3/00

Abstract:
A stringer for having a runout with a raised area configured to reduces stress while improving drainage across the runout when utilized in a close structural component of a vehicle such as an aileron of an aircraft. In one or more configurations, the raised area of the runout of the stringer includes multiple tapered surfaces adjacent to one another oriented and configured as ramps to collectively guide water up, over and down the raised area of the stringer.
Public/Granted literature
- US20190016434A1 LOW STRESS STIFFENER RUNOUT IN PI BONDED STRUCTURE Public/Granted day:2019-01-17
Information query