Invention Grant
- Patent Title: Primer composition and adhesive tape
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Application No.: US15843907Application Date: 2017-12-15
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Publication No.: US10435592B2Publication Date: 2019-10-08
- Inventor: Kohji Kubo , Mizuki Hasumi
- Applicant: Denka Company Limited
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Stein IP, LLC
- Priority: JP2011-121515 20110531
- Main IPC: C08J7/02
- IPC: C08J7/02 ; C09D109/02 ; C09J7/24 ; C09D151/04 ; C09J151/04 ; C09D5/00 ; C09J7/50

Abstract:
An object of the present invention is to provide a primer composition for application between the base film and the adhesive layer of an adhesive tape that can improve the adhesion between the base film and the adhesive layer of the adhesive tape and an adhesive tape prepared by using the primer composition. A primer composition, comprising 100 parts by mass (as solid matter) of a graft polymer of a natural rubber graft-polymerized with 15 to 65 mass % of methyl methacrylate and 25 to 300 parts by mass of a carboxyl group-modified acrylonitrile butadiene rubber.
Public/Granted literature
- US20180105723A1 PRIMER COMPOSITION AND ADHESIVE TAPE Public/Granted day:2018-04-19
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