Invention Grant
- Patent Title: Pressure-sensitive adhesive composition
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Application No.: US14654265Application Date: 2014-09-24
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Publication No.: US10435596B2Publication Date: 2019-10-08
- Inventor: Yoon Gyung Cho , Hyun Jee Yoo , Kyung Yul Bae , Suk Ky Chang , Jung Sup Shim
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2013-0113533 20130924
- International Application: PCT/KR2014/008902 WO 20140924
- International Announcement: WO2015/046881 WO 20150402
- Main IPC: H01L51/54
- IPC: H01L51/54 ; C09J123/20 ; C08K3/34 ; H01L51/00 ; C09J11/02 ; C09J7/10 ; H01L51/52 ; H01L51/56
Abstract:
The present invention relates to a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film including the same, and provides a pressure-sensitive adhesive composition and a pressure-sensitive adhesive film which may prevent damage to an element from moisture contained in the composition, ionic substances, and other foreign substances, and effectively block electrochemical corrosion, thereby improving a lifetime and durability of an organic electronic device.
Public/Granted literature
- US20150329747A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION Public/Granted day:2015-11-19
Information query
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