Invention Grant
- Patent Title: Thermally optimized rings
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Application No.: US15233613Application Date: 2016-08-10
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Publication No.: US10435784B2Publication Date: 2019-10-08
- Inventor: Gangadhar Sheelavant , Cariappa Achappa Baduvamanda , Bopanna Ichettira Vasantha
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: H01L21/326
- IPC: H01L21/326 ; C23C16/00 ; C23C14/50 ; H01J37/32 ; C23C14/34 ; H01J37/34

Abstract:
A process kit ring for use in a plasma processing system is disclosed herein. The process kit ring includes an annular body and one or more hollow inner cavities. The annular body is formed from a plasma resistant material. The annular body has an outer diameter greater than 200 mm. The annular body includes a top surface and a bottom surface. The top surface is configured to face a plasma processing region of a process chamber. The bottom surface is opposite the top surface. The bottom surface is substantially perpendicular to a centerline of the body. The bottom surface is supported at least partially by a pedestal assembly. The one or more hollow inner cavities are formed in the annular body about the centerline. The one or more hollow inner cavities are arranged in a circle within the annular body.
Public/Granted literature
- US20180044783A1 THERMALLY OPTIMIZED RINGS Public/Granted day:2018-02-15
Information query
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