Invention Grant
- Patent Title: Epitaxial growth method for silicon carbide
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Application No.: US15548217Application Date: 2016-02-12
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Publication No.: US10435813B2Publication Date: 2019-10-08
- Inventor: Wataru Ito , Takashi Aigo , Tatsuo Fujimoto
- Applicant: SHOWA DENKO K.K.
- Applicant Address: JP Tokyo
- Assignee: SHOWA DENKO K.K.
- Current Assignee: SHOWA DENKO K.K.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2015-025642 20150212
- International Application: PCT/JP2016/054179 WO 20160212
- International Announcement: WO2016/129685 WO 20160818
- Main IPC: C30B25/20
- IPC: C30B25/20 ; C30B25/14 ; C23C16/42 ; C23C16/452 ; C30B29/36 ; H01L21/205 ; C30B25/16 ; C23C16/32 ; H01L21/02

Abstract:
The present invention provides a method of epitaxial growth of an SiC thin film by the thermal CVD process wherein it is possible to improve the in-plane uniformity of the doping density and possible to grow an SiC thin film by a uniform thickness. This method is an epitaxial growth method for silicon carbide characterized by comprising adjusting a ratio of the hydrocarbon gas and silicon feedstock gas so as to become, by C/Si ratio, 0.5 to 1.5 in range, making the hydrocarbon gas contact a hydrocarbon decomposition catalyst heated to 1000° C. to 1200° C. so as to make at least part of the hydrocarbon gas break down into carbon and hydrogen, and supplying carbon contained in the hydrocarbon gas and silicon contained in the silicon feedstock gas to the silicon carbide single crystal substrate.
Public/Granted literature
- US20180266012A1 EPITAXIAL GROWTH METHOD FOR SILICON CARBIDE Public/Granted day:2018-09-20
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