The present disclosure provides an assembly including a base structure, a pinhole patch and solder. The base structure includes a body that defines a pinhole. The pinhole patch extends at least partially into and at least partially fills the pinhole. An outer surface of the pinhole patch is disposed adjacent and is mechanically joined to a pinhole surface that defines the pinhole. The solder is disposed over at least a portion of the outer surface of the pinhole patch that bonds the pinhole patch at least to the pinhole surface that defines the pinhole. A subassembly is also disclosed. The subassembly includes a pinhole patch and flux.