A method for circuit design includes providing one or more wrapper cells for use with a library of standard cells in design of an IC. Each wrapper cell has geometrical dimensions matching a corresponding group of one or more of the standard cells and defines an electrical path, including at least one via, from a location of a terminal in a lower metal layer in the standard cells in the corresponding group to a location in an upper metal layer. A computerized place-and-route tool receives a layout of the IC including a wrapper cell superimposed over one of the standard cells in the corresponding group. The place-and-route tool automatically routes a signal connection through the upper metal layer and the at least one via defined by the superimposed wrapper cell to the predefined signal terminal in the lower metal layer in the one of the standard cells.