Invention Grant
- Patent Title: Heat-dissipating structure of electronic device
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Application No.: US15989310Application Date: 2018-05-25
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Publication No.: US10437299B2Publication Date: 2019-10-08
- Inventor: Hsin-Wei Wang , Chia-Hsin Chang
- Applicant: Chiun Mai Communication Systems, Inc.
- Applicant Address: TW New Taipei
- Assignee: Chiun Mai Communication Systems, Inc.
- Current Assignee: Chiun Mai Communication Systems, Inc.
- Current Assignee Address: TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN201710531016 20170630
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F1/20 ; H04M1/02 ; H05K7/20

Abstract:
An electronic device includes a first housing portion, a second housing portion, a circuit board, a battery, a display screen, and a heat-dissipating structure. The second housing portion is coupled together with the first housing portion. The circuit board and the battery are received within the second housing portion. The heat-dissipating structure is arranged between the circuit board and the display screen. The heat-dissipating structure includes a substrate including a first surface and a second surface opposite to the first surface and defines an opening passing through the first surface and the second surface. The heat dissipating element is located in the opening.
Public/Granted literature
- US20190004574A1 HEAT-DISSIPATING STRUCTURE OF ELECTRONIC DEVICE Public/Granted day:2019-01-03
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