Invention Grant
- Patent Title: Cleaning apparatus and substrate processing apparatus
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Application No.: US15403719Application Date: 2017-01-11
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Publication No.: US10438817B2Publication Date: 2019-10-08
- Inventor: Haiyang Xu , Mitsuru Miyazaki
- Applicant: Ebara Corporation
- Applicant Address: JP Tokyo
- Assignee: Ebara Corporation
- Current Assignee: Ebara Corporation
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2016-006213 20160115
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B1/04 ; B08B3/04

Abstract:
A cleaning apparatus includes: a cleaning chamber configured to clean a substrate; a transfer chamber positioned adjacent to the cleaning chamber and configured to transfer the substrate; a partition wall partitioning the cleaning chamber and the transfer chamber; a gutter fixed to the partition wall; and a discharge pipe connected to a bottom portion of the gutter. A first pass hole and a second pass hole positioned below the first pass hole are formed in the partition wall. The gutter is positioned between the first pass hole and the second pass hole, and extends from one side end to the other side end of the partition wall.
Public/Granted literature
- US20170207106A1 CLEANING APPARATUS AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2017-07-20
Information query
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