Invention Grant
- Patent Title: Wafer lift ring system for wafer transfer
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Application No.: US15427528Application Date: 2017-02-08
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Publication No.: US10438833B2Publication Date: 2019-10-08
- Inventor: Brian Severson , Ivelin Angelov , James Eugene Caron
- Applicant: LAM RESEARCH CORPORATION
- Applicant Address: US CA Fremont
- Assignee: LAM RESEARCH CORPORATION
- Current Assignee: LAM RESEARCH CORPORATION
- Current Assignee Address: US CA Fremont
- Main IPC: H01L21/68
- IPC: H01L21/68 ; H01L21/687

Abstract:
A substrate support includes an inner portion arranged to support a substrate, a lift ring surrounding the inner portion, the lift ring arranged to support an outer edge of the substrate, and a controller configured to control an actuator to adjust a height of the lift ring relative to the inner portion by selectively raising and lowering at least one of the lift ring and the inner portion of the substrate support. To adjust the height of the lift ring, the controller selectively adjusts the height of the lift ring to a transfer height for transfer of the substrate to the lift ring and retrieval of the substrate from the lift ring, and adjusts the height of the lift ring to a processing height for processing of the substrate.
Public/Granted literature
- US20170236743A1 WAFER LIFT RING SYSTEM FOR WAFER TRANSFER Public/Granted day:2017-08-17
Information query
IPC分类: