Invention Grant
- Patent Title: Electromagnetic shield structure of high frequency circuit and high frequency module
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Application No.: US15770848Application Date: 2015-12-24
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Publication No.: US10438862B2Publication Date: 2019-10-08
- Inventor: Yasuo Morimoto , Hideharu Yoshioka , Akimichi Hirota , Naofumi Yoneda , Takuma Ishibashi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- International Application: PCT/JP2015/085952 WO 20151224
- International Announcement: WO2017/109878 WO 20170629
- Main IPC: H01L23/04
- IPC: H01L23/04 ; H01L23/02 ; H01L23/552 ; H01L23/66 ; H01L23/367 ; H01L23/12 ; H01L23/36
Abstract:
A recess in a metal housing accommodating a high frequency package includes a first space and a second space and has a winners podium shape in cross-sectional view. A thermally conductive material is sandwiched between the metal housing having heat dissipating fins and the high frequency package.
Public/Granted literature
- US20180308776A1 ELECTROMAGNETIC SHIELD STRUCTURE OF HIGH FREQUENCY CIRCUIT AND HIGH FREQUENCY MODULE Public/Granted day:2018-10-25
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