A chip package assembly, a package substrate and methods for fabricating the same are disclosed herein. In one example, a chip package assembly includes a package substrate, an IC die and a stiffener. The package substrate includes a first dam projecting from a top surface of the package substrate. The IC die and the stiffener are mounted to the top surface of the package substrate. The stiffener includes a bottom surface that is disposed adjacent to the first dam. At least one surface mounted component is mounted to a region of the package substrate defined between the stiffener and the IC die. An adhesive coupling the stiffener to the package substrate is in contact with the first dam.