- Patent Title: Power semiconductor module for a motor vehicle and motor vehicle
-
Application No.: US15933836Application Date: 2018-03-23
-
Publication No.: US10438869B2Publication Date: 2019-10-08
- Inventor: Roman Straßer
- Applicant: AUDI AG
- Applicant Address: DE Ingolstadt
- Assignee: AUDI AG
- Current Assignee: AUDI AG
- Current Assignee Address: DE Ingolstadt
- Agency: Maier & Maier, PLLC
- Priority: DE102017207962 20170511
- Main IPC: H01L23/473
- IPC: H01L23/473 ; H01L23/373 ; H01L23/44 ; H01L25/18 ; H05K7/20 ; B60L15/00 ; H01M10/625 ; H01M10/6567 ; H01L25/07 ; B60L50/50 ; B60L58/20
Abstract:
A power semiconductor module for a motor vehicle. a plurality of unhoused power semiconductor chips are provided, which are arranged so that a liquid coolant that is introduced into the power semiconductor module through a liquid coolant feed line can circulate directly around them.
Public/Granted literature
- US20180331017A1 POWER SEMICONDUCTOR MODULE FOR A MOTOR VEHICLE AND MOTOR VEHICLE Public/Granted day:2018-11-15
Information query
IPC分类:
