Invention Grant
- Patent Title: Semiconductor device packaging assembly, lead frame strip and unit lead frame with molding compound channels
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Application No.: US15492259Application Date: 2017-04-20
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Publication No.: US10438870B2Publication Date: 2019-10-08
- Inventor: Boon Teik Tee , Tiam Sen Ong
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L21/78 ; H01L21/48 ; H01L23/31 ; B29C45/14 ; H01L23/00
Abstract:
A semiconductor device packaging assembly includes a lead frame strip having a plurality of unit lead frames. Each of the unit lead frames includes a periphery structure connected to adjacent ones of the unit lead frames, a die paddle inside of the periphery structure, a plurality of leads extending between the periphery structure and the die paddle, and a molding compound channel in the periphery structure configured to guide liquefied molding material onto the periphery structure.
Public/Granted literature
Information query
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