Invention Grant
- Patent Title: Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
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Application No.: US15496951Application Date: 2017-04-25
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Publication No.: US10438876B2Publication Date: 2019-10-08
- Inventor: Dean Fernando , Roel Barbosa , Toshio Takahashi
- Applicant: Infineon Technologies Americas Corp.
- Applicant Address: US CA El Segundo
- Assignee: Infineon Technologies Americas Corp.
- Current Assignee: Infineon Technologies Americas Corp.
- Current Assignee Address: US CA El Segundo
- Agency: Shumaker & Sieffert, P.A.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/31

Abstract:
According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a driver integrated circuit (IC) situated on a leadframe. The PQFN package further includes low-side U-phase, low-side V-phase, and low-side W-phase power switches situated on the leadframe. A logic ground of the leadframe is coupled to a support logic circuit of the driver IC. A power stage ground of the leadframe is coupled to sources of the low-side U-phase, low-side V-phase, and low-side W-phase power switches. The power stage ground can further be coupled to gate drivers of the driver IC.
Public/Granted literature
- US20170229383A1 POWER QUAD FLAT NO-LEAD (PQFN) PACKAGE IN A SINGLE SHUNT INVERTER CIRCUIT Public/Granted day:2017-08-10
Information query
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