Invention Grant
- Patent Title: Liquid ejection head substrate and semiconductor substrate
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Application No.: US15912858Application Date: 2018-03-06
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Publication No.: US10438912B2Publication Date: 2019-10-08
- Inventor: Koji Sasaki , Shingo Nagata
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Venable LLP
- Priority: JP2017-054760 20170321
- Main IPC: H01L23/00
- IPC: H01L23/00 ; B41J2/16 ; B41J2/14

Abstract:
A liquid ejection head substrate includes an electrode pad for receiving driving power for liquid ejection from an outside, the electrode pad including at least a conductor layer and a layer of gold. A portion of the conductor layer has an opening region, and an upper layer portion in a laminating direction above the conductor layer including the opening region has at least the layer of gold. An external connection portion connected to the outside is provided on top of the layer of gold corresponding to the opening region of the conductor layer.
Public/Granted literature
- US20180277503A1 LIQUID EJECTION HEAD SUBSTRATE AND SEMICONDUCTOR SUBSTRATE Public/Granted day:2018-09-27
Information query
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