Invention Grant
- Patent Title: Semiconductor device, manufacturing method therefor and semiconductor module
-
Application No.: US15536353Application Date: 2015-01-13
-
Publication No.: US10438947B2Publication Date: 2019-10-08
- Inventor: Kazuhiro Nishimura , Makoto Ueno , Masataka Mametuka
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- International Application: PCT/JP2015/050641 WO 20150113
- International Announcement: WO2016/113841 WO 20160721
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/739 ; H01L29/74 ; H01L21/8222 ; H01L29/06 ; H01L29/66 ; H01L27/07 ; H01L23/52 ; H01L27/092

Abstract:
A semiconductor device of the present invention achieves improved avoidance of a parasitic operation in a circuit region while achieving miniaturization of the semiconductor device and a reduction in the amount of time for manufacturing the semiconductor device. The semiconductor device according to the present invention includes an IGBT disposed on a first main surface of a semiconductor substrate provided with a drift layer of a first conductivity type; a thyristor disposed on the first main surface of the semiconductor substrate; a circuit region; a hole-current retrieval region separating the IGBT and the circuit region in a plan view; and a diffusion layer of a second conductivity type, the diffusion layer being disposed on a second main surface of the semiconductor substrate. The IGBT has an effective area equal to or less than an effective area of the thyristor in a plan view.
Public/Granted literature
- US20170345817A1 SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR MODULE Public/Granted day:2017-11-30
Information query
IPC分类: