Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15921056Application Date: 2018-03-14
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Publication No.: US10438951B2Publication Date: 2019-10-08
- Inventor: Shuntaro Fujii , Tatsushi Yagi , Shohei Hamada
- Applicant: ASAHI KASEI MICRODEVICES CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ASAHI KASEI MICRODEVICES CORPORATION
- Current Assignee: ASAHI KASEI MICRODEVICES CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Morgan, Lewis & Bockius LLP
- Priority: JP2017-059701 20170324; JP2017-251717 20171227
- Main IPC: H01L27/092
- IPC: H01L27/092 ; H01L21/8234 ; H01L27/088 ; H01L21/266 ; H01L29/06 ; H01L21/8238

Abstract:
An object of the present invention is to provide a semiconductor device and a manufacturing method thereof that may achieve low power consumption in a digital circuit and reduce influence of noise in an analog circuit. The manufacturing method of the semiconductor device includes a first source/drain forming step of forming a first source region and a first drain region by implanting impurities of a second conductivity type into a digital side second conductivity type impurity layer using a gate electrode and a sidewall as a mask and a second drain/source forming step of forming a second source region and a second drain region by implanting impurities of the second conductivity type into an analog side second conductivity type impurity layer using a gate electrode and a sidewall as a mask more shallowly than the impurities of the second conductivity type implanted in the first source/drain forming step.
Public/Granted literature
- US20180277438A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2018-09-27
Information query
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