Invention Grant
- Patent Title: Semiconductor device and method of fabricating the same
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Application No.: US15972395Application Date: 2018-05-07
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Publication No.: US10438969B2Publication Date: 2019-10-08
- Inventor: In Su Park , Dong Sun Sheen
- Applicant: SK hynix Inc.
- Applicant Address: KR Icheon-si, Gyeonggi-do
- Assignee: SK hynix Inc.
- Current Assignee: SK hynix Inc.
- Current Assignee Address: KR Icheon-si, Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2017-0123410 20170925
- Main IPC: G11C16/14
- IPC: G11C16/14 ; H01L27/11582 ; H01L29/08 ; H01L29/10 ; H01L23/522 ; G11C16/04 ; G11C16/26 ; G11C16/34 ; H01L21/02 ; H01L21/311 ; H01L21/28

Abstract:
Provided herein may be a semiconductor device and a method of manufacturing the same. The semiconductor device may include a memory string including memory cells coupled to each other in series via a channel layer, the memory string coupled between a bit line and a second source line. The semiconductor device may include a first source line electrically coupled to the second source line through the channel layer.
Public/Granted literature
- US10559589B2 Semiconductor device and method of fabricating the same Public/Granted day:2020-02-11
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