Invention Grant
- Patent Title: Method of fabricating fill factor enhancement for image sensor
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Application No.: US16150876Application Date: 2018-10-03
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Publication No.: US10438979B2Publication Date: 2019-10-08
- Inventor: Ognjen Milic-Strkalj
- Applicant: OmniVision Technologies, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Johnson Kindness PLLC
- Agent Christensen O'Connor
- Main IPC: H01L31/062
- IPC: H01L31/062 ; H01L27/146

Abstract:
An image sensor includes a plurality of photodiodes disposed in a semiconductor material and a plurality of isolation structures disposed between individual photodiodes in the plurality of photodiodes. The plurality of isolation structures electrically isolate individual photodiodes in the plurality of photodiodes. A plurality of transistors are disposed proximate to the plurality of photodiodes and include a reset transistor, an amplifier transistor, and a row select transistor. An active region and a gate electrode of at least one transistor in the plurality of transistors are vertically aligned with an isolation structure in the plurality of isolation structures.
Public/Granted literature
- US20190035833A1 FILL FACTOR ENHANCEMENT Public/Granted day:2019-01-31
Information query
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