Invention Grant
- Patent Title: Integrated-circuit devices including different types of memory cells and methods of forming the same
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Application No.: US15828937Application Date: 2017-12-01
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Publication No.: US10438998B2Publication Date: 2019-10-08
- Inventor: Kilho Lee , Gwanhyeob Koh , Hongsoo Kim , Junhee Lim , Chang-Hoon Jeon
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2017-0070863 20170607
- Main IPC: G11C5/02
- IPC: G11C5/02 ; H01L27/24 ; G11C11/00 ; H01L45/00 ; H01L27/11573 ; G11C13/00 ; H01L27/22 ; G11C11/16 ; H01L43/08 ; H01L49/02 ; H01L27/11582

Abstract:
Integrated circuit devices may include a substrate including a flash memory region and a variable resistance memory region, a flash memory cell transistor including a cell gate electrode that overlaps the flash memory region of the substrate, a variable resistance element that overlaps the variable resistance memory region of the substrate, and a select transistor including a select source/drain region that is disposed in the variable resistance memory region of the substrate. The select source/drain region may be electrically connected to the variable resistance element. The substrate may include an upper surface facing the cell gate electrode and the variable resistance element, and the upper surface of the substrate may continuously extend from the flash memory region to the variable resistance memory region.
Public/Granted literature
- US20180358408A1 INTEGRATED-CIRCUIT DEVICES INCLUDING DIFFERENT TYPES OF MEMORY CELLS AND METHODS OF FORMING THE SAME Public/Granted day:2018-12-13
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