Invention Grant
- Patent Title: Semiconductor device and method of manufacturing same
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Application No.: US15978296Application Date: 2018-05-14
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Publication No.: US10439032B2Publication Date: 2019-10-08
- Inventor: Atsushi Yoshitomi , Yoshiyuki Kawashima
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2017-122001 20170622
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L27/11568 ; H01L29/66 ; H01L29/78 ; H01L29/792

Abstract:
To provide a semiconductor device having improved reliability by relaxing the unevenness of the injection distribution of electrons and holes into a charge accumulation film attributable to the shape of the fin of a MONOS memory comprised of a fin transistor. Of a memory gate electrode configuring a memory cell formed above a fin, a portion contiguous to an ONO film that covers the upper surface of the fin and a portion contiguous to the ONO film that covers the side surface of the fin are made of electrode materials different in work function, respectively, and the boundary surface between them is located below the upper surface of the fin.
Public/Granted literature
- US20180374924A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME Public/Granted day:2018-12-27
Information query
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