Invention Grant
- Patent Title: Semiconductor device and method of manufacturing semiconductor device
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Application No.: US15993281Application Date: 2018-05-30
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Publication No.: US10439060B2Publication Date: 2019-10-08
- Inventor: Naoyuki Ohse , Shinsuke Harada , Makoto Utsumi , Yasuhiko Oonishi
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki-Shi, Kanagawa
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa
- Agency: Rabin & Berdo, P.C.
- Priority: JP2017-118881 20170616
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/10 ; H01L29/66 ; H01L29/16

Abstract:
A semiconductor device includes an n-type silicon carbide epitaxial layer on a front surface of an n+-type silicon carbide substrate. A first p+-type base region is provided in the n-type silicon carbide epitaxial layer and a breakdown voltage structure region is provided in an outer periphery of an active region through which a main current flows. A distance between the first p+-type base region and a front surface of the n+-type silicon carbide substrate is smaller than a distance between the breakdown voltage structure region and the front surface of the n+-type silicon carbide substrate.
Public/Granted literature
- US20180366574A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2018-12-20
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