Invention Grant
- Patent Title: Method for depositing a conductive coating on a surface
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Application No.: US14440797Application Date: 2013-11-06
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Publication No.: US10439081B2Publication Date: 2019-10-08
- Inventor: Michael Helander , Jacky Qiu , Zhibin Wang , Zheng-Hong Lu
- Applicant: OTI Lumionics Inc.
- Applicant Address: CA Toronto
- Assignee: OTI Lumionics Inc.
- Current Assignee: OTI Lumionics Inc.
- Current Assignee Address: CA Toronto
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/CA2013/050848 WO 20131106
- International Announcement: WO2014/071518 WO 20140515
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L31/0236 ; C23C14/20 ; C23C14/02 ; C23C14/24 ; H01L51/00 ; H01L51/44 ; H01L51/52 ; C09D5/24 ; H01L31/18 ; H01L51/56 ; H01L31/0256
Abstract:
A method for depositing a conductive coating on a surface is provided, the method including treating the surface by depositing fullerene on the surface to produce a treated surface and depositing the conductive coating on the treated surface. The conductive coating generally includes magnesium. A product and an organic optoelectronic device produced according to the method are also provided.
Public/Granted literature
- US20150287846A1 METHOD FOR DEPOSITING A CONDUCTIVE COATING ON A SURFACE Public/Granted day:2015-10-08
Information query
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