Invention Grant
- Patent Title: Thermoelectric conversion module, heat conductive laminate, and method of producing thermoelectric conversion module
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Application No.: US16015306Application Date: 2018-06-22
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Publication No.: US10439124B2Publication Date: 2019-10-08
- Inventor: Shinji Imai , Hideyuki Suzuki
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Minato-ku, Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Minato-ku, Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2015-254646 20151225; JP2016-108428 20160531
- Main IPC: H01L35/32
- IPC: H01L35/32 ; H02N11/00 ; H01L35/34 ; H01L35/16 ; H01L35/18 ; H01L35/22

Abstract:
An object of the present invention is to provide a thermoelectric conversion module which is obtained by combining an insulating member, a heat dissipation member, or the like with a bellows-like thermoelectric conversion module and has good structural stability and handleability and good flexibility, a heat conductive laminate used for the thermoelectric conversion module, and methods of producing the same. The object is achieved by providing a thermoelectric conversion module including a module main body having a bellows-like support, thermoelectric conversion layers formed on the support and are separated from each other, connection electrodes which connect the thermoelectric conversion layers adjacent to each other; one or more bellows-like members provided such that concave and convex portions thereof are fitted to those of the module main body; and a flexible linear member which penetrates sloped surfaces of a bellows of the module main body and sloped surfaces of a bellows of one or more bellows-like members so as to be inserted through the module main body and the one or more bellows-like members.
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