Invention Grant
- Patent Title: Hydrogen-releasing film
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Application No.: US15318856Application Date: 2015-06-12
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Publication No.: US10439185B2Publication Date: 2019-10-08
- Inventor: Takahiro Fukuoka , Kyoko Ishii , Shunsuke Masaki , Kenta Hata , Hiroshi Yukawa , Tomonori Nanbu
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2014-123485 20140616
- International Application: PCT/JP2015/067000 WO 20150612
- International Announcement: WO2015/194470 WO 20151223
- Main IPC: H01M2/12
- IPC: H01M2/12 ; B01D69/10 ; B01D69/12 ; B01D71/02 ; B01D71/36 ; B01D71/38 ; H01G9/12 ; H01G11/14 ; H01G9/045 ; H01M10/0525 ; C22C5/04
Abstract:
The objective of the present invention is to provide a hydrogen-releasing film, a composite hydrogen-releasing film and a hydrogen-releasing laminated film that are not prone to embrittlement in the usage environmental temperatures of electrochemical elements. The hydrogen-releasing film containing an alloy, wherein the alloy is a Pd—Au alloy, and the Au content in the Pd—Au alloy is 15 mol % or more.
Public/Granted literature
- US10374202B2 Hydrogen-releasing film Public/Granted day:2019-08-06
Information query
