Invention Grant
- Patent Title: Manufacturing method of light-emitting device
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Application No.: US15496846Application Date: 2017-04-25
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Publication No.: US10439358B2Publication Date: 2019-10-08
- Inventor: Soichiro Miura , Seiji Kiyota , Eiichiro Okahisa
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-Shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-Shi
- Agency: Foley & Lardner LLP
- Priority: JP2016-092102 20160428; JP2017-021459 20170208
- Main IPC: H01S5/022
- IPC: H01S5/022 ; H01S5/40 ; H01S5/024 ; H01S5/323 ; H01S5/00

Abstract:
A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.
Public/Granted literature
- US20170317467A1 MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE Public/Granted day:2017-11-02
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