Invention Grant
- Patent Title: Substrate unit
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Application No.: US16062997Application Date: 2017-06-07
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Publication No.: US10439379B2Publication Date: 2019-10-08
- Inventor: Hideaki Tahara , Arinobu Nakamura , Kazuyoshi Ohara , Munsoku O
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-Shi, Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-Shi, Osaka
- Agency: Honigman LLP
- Priority: JP2016-114858 20160608
- International Application: PCT/JP2017/021200 WO 20170607
- International Announcement: WO2017/213194 WO 20171214
- Main IPC: H02G3/16
- IPC: H02G3/16 ; H05K7/06 ; H01R25/16 ; H05K5/02 ; B60R16/023 ; H05K1/00 ; H05K5/00 ; H01R12/71 ; H01R12/70 ; H01R12/72 ; H02G3/08

Abstract:
A substrate unit includes a circuit board, a connector portion installed at the front end portion of the upper side of the circuit board, a busbar connected to the circuit board and fixed to the lower side of the circuit board, a bottom portion including a recessed portion overlapping the front end portion of the circuit board and arranged on the lower side of the busbar, and a bonding layer fixing the busbar to the bottom portion. The busbar includes a non-bonding region that faces the recessed portion. A bonding region includes the bonding layer surrounding three sides other than a front side, namely a left side, a right side, and a rear side, of the non-bonding region. Notches are located on a left side and a right side of the front end portion and overlap extension lines of boundary between the non-bonding and the bonding region.
Public/Granted literature
- US20190123539A1 SUBSTRATE UNIT Public/Granted day:2019-04-25
Information query
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