Invention Grant
- Patent Title: Coupling device modules for inductive data transmission
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Application No.: US15233888Application Date: 2016-08-10
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Publication No.: US10439449B2Publication Date: 2019-10-08
- Inventor: Vicente Calvo Alonso , Antti Karilainen , Esa Määttä
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Main IPC: H02J50/80
- IPC: H02J50/80 ; H02J50/10 ; G06F1/16 ; H02J7/02 ; H02J5/00

Abstract:
A first device module comprises a first coupling arrangement; the first coupling arrangement comprising a first inductive coil, a first magnetic core positioned within the first inductive coil to form a first electromagnet, and a first control unit electrically connected to the first inductive coil. The first control unit is configured to supply first DC current to the first inductive coil to generate a first magnetic field to attract a second device module comprising a second magnetic element and a second inductive coil by magnetic force, and first AC current to the first inductive coil to inductively transmit a first data or power signal from the first inductive coil to the second inductive coil.
Public/Granted literature
- US20180048192A1 COUPLING DEVICE MODULES FOR INDUCTIVE DATA TRANSMISSION Public/Granted day:2018-02-15
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