An electronic module includes a substrate, at least one first electronic component that includes a hollow portion, at least one second electronic component that includes no hollow portion, a first sealing resin, and a second sealing resin. The at least one first electronic component is sealed with the first sealing resin. The at least one second electronic component has a narrowest pitch between the electrodes that are provided on the mounting surface, and at least the mounting surface including the electrodes of the at least one second electronic component are sealed with the second sealing resin. The volume percentage of a filler that is included in the first sealing resin is larger than the volume percentage of a filler that is included in the second sealing resin.