Invention Grant
- Patent Title: MEMS device with large out-of-plane actuation and low-resistance interconnect and methods of use
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Application No.: US15274433Application Date: 2016-09-23
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Publication No.: US10439591B2Publication Date: 2019-10-08
- Inventor: Michael Jarret Holyoak , George Kenneth Kannell , Marc Jay Beacken , David J. Bishop , Jackson Chang , Matthias Imboden
- Applicant: LGS INNOVATIONS LLC
- Applicant Address: US VA Herndon
- Assignee: LGS Innovations LLC
- Current Assignee: LGS Innovations LLC
- Current Assignee Address: US VA Herndon
- Agency: Baker & Hostetler LLP
- Main IPC: H01P7/06
- IPC: H01P7/06 ; H03H9/46 ; H01P1/205 ; H01P7/04

Abstract:
The present application is directed to a MEMS device. The MEMS device includes a substrate having a first end and a second end extending along a longitudinal axis, the substrate including an electrostatic actuator. The device also includes a movable plate having a first end and a second end. The device also includes a thermal actuator having a first end coupled to the first end of the substrate and a second end coupled to the first end of the plate. The actuator moves the plate in relation to the substrate. Further, the device includes a power source electrically coupled to the thermal actuator and the substrate. The application is also directed to a method for operating a MEMS device.
Public/Granted literature
- US20170141755A1 MEMS DEVICE WITH LARGE OUT-OF-PLANE ACTUATION AND LOW-RESISTANCE INTERCONNECT AND METHODS OF USE Public/Granted day:2017-05-18
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