Invention Grant
- Patent Title: Optical interconnect modules with AWG polymer waveguide on silicon substrate
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Application No.: US15965213Application Date: 2018-04-27
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Publication No.: US10439721B2Publication Date: 2019-10-08
- Inventor: Abraham Jou , Paul Mao-Jen Wu
- Applicant: ADOLITE INC.
- Applicant Address: US CA Santa Clara
- Assignee: ADOLITE INC.
- Current Assignee: ADOLITE INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Alston & Bird LLP
- Main IPC: H04B10/25
- IPC: H04B10/25 ; G02B6/42 ; G02B6/12 ; H04B10/50 ; H04B10/67 ; H04J14/02 ; H05K1/02 ; H01S5/022 ; H01S5/183 ; H05K1/18

Abstract:
An optical interconnect system has a transmitter and a receiver connected by a single mode fiber. An array of DML lasers in the transmitter emits multiple wavelengths which are multiplexed to the single mode fiber with an array waveguide grating (AWG) device. The receiver demultiplexes the different wavelengths by an AWG polymer waveguide fabricated in a trench on the silicon surface. The AWG demultiplexer includes a high-NA polymer waveguide which has an end reflector approximately formed at 45 degrees for reflecting light from AWG into multiple photodetectors assembled outside the trench. Optionally, a number of through-silicon-vias (TSVs) allow electrical connection access to the lasers and the driver circuit from the backside of the silicon substrate by external power sources.
Public/Granted literature
- US20180337743A1 Optical Interconnect Modules with AWG Polymer Waveguide on Silicon Substrate Public/Granted day:2018-11-22
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