Invention Grant
- Patent Title: Speaker module
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Application No.: US15984438Application Date: 2018-05-21
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Publication No.: US10440466B2Publication Date: 2019-10-08
- Inventor: Jia-Ren Chang , Wan-Chi Lin
- Applicant: Acer Incorporated
- Applicant Address: TW New Taipei
- Assignee: Acer Incorporated
- Current Assignee: Acer Incorporated
- Current Assignee Address: TW New Taipei
- Agency: JCIPRNET
- Priority: TW107106764A 20180301
- Main IPC: H04R1/28
- IPC: H04R1/28
Abstract:
A speaker module including a speaker box, a diaphragm and a plurality of porous grains is provided. The diaphragm is disposed on the speaker box and adapted to receive a signal to vibrate. The porous grains are disposed in the speaker box and adapted to absorb energy of air in the speaker box.
Public/Granted literature
- US20190182581A1 SPEAKER MODULE Public/Granted day:2019-06-13
Information query
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