Invention Grant
- Patent Title: Interposers with electrically conductive features having different porosities
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Application No.: US15682049Application Date: 2017-08-21
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Publication No.: US10440822B2Publication Date: 2019-10-08
- Inventor: Bong-Sub Lee , Cyprian Emeka Uzoh , Charles G. Woychik , Liang Wang , Laura Wills Mirkarimi , Arkalgud R. Sitaram
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H05K13/04
- IPC: H05K13/04 ; H05K1/09 ; H01L23/498 ; H01L21/48 ; H05K1/11 ; H05K1/16 ; H05K3/18
Abstract:
Interposer circuitry (130) is formed on a possibly sacrificial substrate (210) from a porous core (130′) covered by a conductive coating (130″) which increases electrical conductance. The core is printed from nanoparticle ink. Then a support (120S) is formed, e.g. by molding, to mechanically stabilize the circuitry. A magnetic field can be used to stabilize the circuitry while the circuitry or the support are being formed. Other features are also provided.
Public/Granted literature
- US20170374738A1 Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields Public/Granted day:2017-12-28
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