Invention Grant
- Patent Title: Conductive pattern formation method and conductive pattern formation device
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Application No.: US14739224Application Date: 2015-06-15
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Publication No.: US10440831B2Publication Date: 2019-10-08
- Inventor: Dai Suwama , Sayaka Morita , Keita Saito , Midori Shimomura
- Applicant: Konica Minolta, Inc.
- Applicant Address: JP Chiyoda-Ku, Tokyo
- Assignee: KONICA MINOLTA, INC.
- Current Assignee: KONICA MINOLTA, INC.
- Current Assignee Address: JP Chiyoda-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2014-128722 20140624
- Main IPC: H05K3/12
- IPC: H05K3/12
Abstract:
A conductive pattern formation method includes: a step of patterning a base member with an ink in which conductive particulates are distributed to form a pattern; a step of making a conductive developer act on the pattern; and a pressurization step of pressurizing the pattern.
Public/Granted literature
- US20150371740A1 CONDUCTIVE PATTERN FORMATION METHOD AND CONDUCTIVE PATTERN FORMATION DEVICE Public/Granted day:2015-12-24
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