Invention Grant
- Patent Title: Plastic molding compound and use thereof
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Application No.: US15037418Application Date: 2014-12-16
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Publication No.: US10440832B2Publication Date: 2019-10-08
- Inventor: Georg Stoeppelmann
- Applicant: EMS-PATENT AG
- Applicant Address: CH Domat/Ems
- Assignee: EMS-PATENT AG
- Current Assignee: EMS-PATENT AG
- Current Assignee Address: CH Domat/Ems
- Agency: Sughrue Mion, PLLC
- Priority: EP13199146 20131220
- International Application: PCT/EP2014/077910 WO 20141216
- International Announcement: WO2015/091447 WO 20150625
- Main IPC: H05K3/18
- IPC: H05K3/18 ; C08K3/22 ; C08K3/24 ; C08K7/14 ; C08L77/00 ; H05K3/00 ; C08L77/04 ; C08L77/06 ; H05K3/20

Abstract:
A method for producing a laser-structurable component, wherein an extruded single- or multilayer molded part with at least one laser-structurable layer that forms an exposed surface of the molded part is applied onto the surface of a non-laser-structurable support element. Alternatively, the at least one laser-structurable layer may be back-molded with a non-laser-structurable thermoplastic support element so that at least one laser-structurable layer of the molded part forms at least one part of the surface of the laser-structurable component. The extruded single- or multilayer molded part is deep-drawn into the component. In the process, the laser-structurable layer of the molded part consists of a thermoplastic molding compound consisting of: (A) 30-99.9 wt. % of a thermoplastic consisting of polyamide; (B) 0.1-10 wt. % of an LDS additive; and (C) 0-60 wt. % of an additive material which is different from (A) and (B).
Public/Granted literature
- US20160295705A1 PLASTIC MOLDING COMPOUND AND USE THEREOF Public/Granted day:2016-10-06
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