Invention Grant
- Patent Title: Temperature sensitive NAND programming
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Application No.: US16024316Application Date: 2018-06-29
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Publication No.: US10446237B1Publication Date: 2019-10-15
- Inventor: Xiangang Luo , Jianmin Huang , Jung Sheng Hoei , Harish Reddy Singidi , Ting Luo , Ankit Vashi
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: G11C16/10
- IPC: G11C16/10 ; G11C16/34 ; G11C7/04
Abstract:
Devices and techniques temperature sensitive NAND programming are disclosed herein. A device controller can receive a command to write data to a component of the device. A temperature can be obtained in response to the command, and the temperature can be combined with a temperature compensation value to calculate a verification level. The command can then be executed in accordance with the verification level.
Information query
