Invention Grant
- Patent Title: Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor
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Application No.: US14555633Application Date: 2014-11-27
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Publication No.: US10446335B2Publication Date: 2019-10-15
- Inventor: Dror Hurwitz , Alex Huang
- Applicant: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- Applicant Address: CN Zhuhai
- Assignee: Zhuhai ACCESS Semiconductor Co., Ltd.
- Current Assignee: Zhuhai ACCESS Semiconductor Co., Ltd.
- Current Assignee Address: CN Zhuhai
- Agency: Wiggin and Dana LLP
- Agent Gregory S. Rosenblatt; Jonathan D. Hall
- Main IPC: H01G17/00
- IPC: H01G17/00 ; H05K1/16 ; H05K1/11 ; H01G4/12 ; H01G4/008 ; H01G4/33 ; H01G4/224 ; H01G4/228 ; H01L49/02 ; H05K3/46 ; H01L23/498 ; H01L23/538 ; H01F27/28 ; H03H7/01 ; H01L23/00 ; H05K1/18 ; H05K3/00
Abstract:
A chip socket defined by an organic matrix framework, wherein the organic matrix framework comprises at least one via post layer where at least one via through the framework around the socket includes at least one capacitor comprising a lower electrode, a dielectric layer and an upper electrode in contact with the via post.
Public/Granted literature
- US20150228416A1 Polymer Frame for a Chip, Such That the Frame Comprises at Least One Via in Series with a Capacitor Public/Granted day:2015-08-13
Information query
