Invention Grant
- Patent Title: Upper cone for epitaxy chamber
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Application No.: US15637930Application Date: 2017-06-29
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Publication No.: US10446420B2Publication Date: 2019-10-15
- Inventor: Shinichi Oki , Yoshinobu Mori , Yuji Aoki
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; C23C16/48 ; H01L21/20 ; C23C16/44 ; C23C16/46 ; C30B25/14 ; C23C16/455 ; C23C16/52

Abstract:
An epitaxial deposition chamber having an upper cone for controlling air flow above a dome in the chamber, such as a high growth rate epitaxy chamber, is described herein. The upper cone has first and second components separated by two or more gaps in the chamber, each component having a partial cylindrical region having a first concave inner surface, a first convex outer surface, and a fixed radius of curvature of the first concave inner surface, and a partial conical region extending from the partial cylindrical region, the partial conical region having a second concave inner surface, a second convex outer surface, and a varying radius of curvature of the second concave inner surface, wherein the second concave inner surface extends from the partial cylindrical region to a second radius of curvature less than the fixed radius of curvature.
Public/Granted literature
- US20180053670A1 UPPER CONE FOR EPITAXY CHAMBER Public/Granted day:2018-02-22
Information query
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