Invention Grant
- Patent Title: Semiconductor device and manufacturing method thereof
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Application No.: US15582923Application Date: 2017-05-01
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Publication No.: US10446569B2Publication Date: 2019-10-15
- Inventor: Tamotsu Ogata
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2016-112601 20160606
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L27/115 ; H01L27/11568 ; H01L21/265 ; H01L29/66 ; H01L29/78 ; H01L29/792 ; H01L29/423 ; H01L27/11517 ; H01L27/11524 ; H01L29/788

Abstract:
An improvement is achieved in the performance of a semiconductor device having a nonvolatile memory. A first memory cell includes a first control gate electrode and a first memory gate electrode which are formed over a semiconductor substrate to be adjacent to each other. A second memory cell includes a second control gate electrode and a second memory gate electrode which are formed over the semiconductor substrate to be adjacent to each other. A width of a sidewall spacer formed on a side of the second memory gate electrode opposite to a side thereof where the second memory gate electrode is adjacent to the second control gate electrode is smaller than a width of another sidewall spacer formed on a side of the first memory gate electrode opposite to a side thereof where the first memory gate electrode is adjacent to the first control gate electrode. A threshold voltage of a first memory transistor including the first memory gate electrode in a neutral state is different a threshold voltage of a second memory transistor including the second memory gate electrode in the neutral state.
Public/Granted literature
- US20170352676A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-12-07
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