Invention Grant
- Patent Title: Optocoupler device and frame module thereof
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Application No.: US15784923Application Date: 2017-10-16
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Publication No.: US10446708B2Publication Date: 2019-10-15
- Inventor: Chien-Chung Hsiao , Chih-Cheng Chien
- Applicant: ANPEC ELECTRONICS CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: ANPEC ELECTRONICS CORPORATION
- Current Assignee: ANPEC ELECTRONICS CORPORATION
- Current Assignee Address: TW Hsinchu
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: TW106125115A 20170726
- Main IPC: H01L31/147
- IPC: H01L31/147 ; H01L33/62 ; H03K17/78 ; H01L25/16 ; H04B10/80 ; H01L31/12

Abstract:
An optocoupler device for receiving a load voltage larger than or equal to 5 KV includes a carrier, a supporting frame connected to the carrier, a light emitter and a light receiver spacedly mounted on the carrier, an electrical isolator at least partially disposed on the supporting frame, a translucent encapsulate, and an opaque encapsulate. The electrical isolator is translucent and has a dielectric strength larger than or equal to 50 KV/mm. A shortest light transmitting path between the light emitter and the light receiver passes through the electrical isolator. The supporting frame, the light emitter, the light receiver, and at least part of the electrical isolator are embedded in the translucent encapsulate, and the translucent encapsulate is embedded in the opaque encapsulate.
Public/Granted literature
- US20190035966A1 OPTOCOUPLER DEVICE AND FRAME MODULE THEREOF Public/Granted day:2019-01-31
Information query
IPC分类: