Invention Grant
- Patent Title: Fabrication method of vertical light-emitting diode
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Application No.: US15810056Application Date: 2017-11-11
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Publication No.: US10446718B2Publication Date: 2019-10-15
- Inventor: Jin Wang , Yi-an Lu , Chun-Yi Wu , Ching-Shan Tao , Duxiang Wang
- Applicant: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Xiamen
- Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Xiamen
- Agency: Syncoda LLC
- Agent Feng Ma
- Priority: CN201510890183 20151208
- Main IPC: H01L33/38
- IPC: H01L33/38 ; H01L33/62 ; H01L33/24 ; H01L33/40 ; H01L33/00

Abstract:
A fabrication method of a vertical light-emitting diode, such as an infrared light-emitting diode, includes heating the reaction chamber during growth of the reflective layer to pre-diffuse the metal molecules of the reflective layer into the epitaxial layer. As a result, the diffusion of the metal molecules in the reflective layer into the epitaxial layer during high-temperature fusion of the reflective layer and the epitaxial layer slows down, and the blackness level of conventional ohm contact holes is reduced.
Public/Granted literature
- US20180076361A1 Fabrication Method of Vertical Light-Emitting Diode Public/Granted day:2018-03-15
Information query
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