Invention Grant
- Patent Title: Circuit assembly and electrical junction box
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Application No.: US15758926Application Date: 2016-09-06
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Publication No.: US10448497B2Publication Date: 2019-10-15
- Inventor: Takuya Ota , Shigeki Yamane , Hirotoshi Maeda , Toshiyuki Tsuchida , Yoshihiro Tozawa
- Applicant: AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-Shi, Osaka
- Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee: AutoNetworks Technologies, Ltd.,Sumitomo Wiring Systems, Ltd.,Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Yokkaichi, Mie JP Yokkaichi, Mie JP Osaka-Shi, Osaka
- Agency: Honigman LLP
- Priority: JP2015-179420 20150911
- International Application: PCT/JP2016/076088 WO 20160906
- International Announcement: WO2017/043462 WO 20170316
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K7/20 ; H05K1/18 ; H05K7/14
Abstract:
A circuit assembly includes a circuit board on which a coil is mounted, a heat sink, and a heat spreading plate that is separate from this heat sink. A first insulating adhesive layer is interposed between the circuit board and the heat spreading plate, and the heat spreading plate and the heat sink are fixed by a first fixing hole for a heat sink and a bolt. Accordingly, warping of the circuit board is suppressed.
Public/Granted literature
- US20190045618A1 CIRCUIT ASSEMBLY AND ELECTRICAL JUNCTION BOX Public/Granted day:2019-02-07
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