- Patent Title: Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna
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Application No.: US15405517Application Date: 2017-01-13
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Publication No.: US10448507B2Publication Date: 2019-10-15
- Inventor: Ryo Fukuchi
- Applicant: JX NIPPON MINING & METALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee: JX Nippon Mining & Metals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2016-005645 20160115
- Main IPC: C25D3/38
- IPC: C25D3/38 ; H05K1/09 ; C22F1/08 ; C25D7/06 ; H05K1/03 ; C25D3/12 ; C25D3/56 ; C25D5/48 ; C25D9/08
Abstract:
To provide a copper foil and a copper-clad laminate board that have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board that is folded in use or bent in use. A copper foil having a number of times of folding of 1 or more in a folding test under a prescribed condition for a copper-clad laminate board containing the copper foil having adhered thereto an insulating substrate.
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